IC Backend

Taiwan China

2.5D / TSV bonder / De-Bonder Release Layer coating service

2D / 3D X-Ray CT Inspection Machine

2D/3D in-tray AOI Machine

Ag Silver Flake

Ag Silver Powder

AgCu Flake

AgPd Powder

Au Powder

Coating, Stripping, developing, hotplates, lift-off equipment for singal wafer process

Cu & Ti seed layer etchant /Electroless Plating (ENIG/ ENEPIG)

Cu Powder

Electro Chemical Plating / SFP(Stress Free Polish)/Coater

Electroless Plating(ENIG/ENEPIG) service

Flux Cleaner / Dry film PR stripper

Flux-Free Vacuum Reflow System

IGBT Module Vacuum Reflow System

Ink Jet Marking equipment

Laser Grooving/ Laser Marking

MEMS Probe Pin Wafer Test Solution, Test Rubber Socket for Final Test

Pd Powder

Plasma Clean Solution

Positive/Negative Photoresist/ PSPI Developer

Pressure Oven/Vacuum Laminator

Pt Powder

Resistivity test system

Sintering Ag paste/Heat Dissipation Sheet

Sintering Cu paste

Temoprary Bonding/Debonding Solution, Equipment and material

Thermal Release Tape for temporary bonding

TR AOI Machine

Underfill material, wafer Level CSP material, Die Attach Adhesive

UV Tape / Release Film / Backside Grinding Film