2.5D / TSV bonder / De-Bonder Release Layer coating service
2D / 3D X-Ray CT Inspection Machine
2D/3D in-tray AOI Machine
2D&3D Wafer AOI Inspection System
Cu & Ti seed layer etchant /Electroless Plating (ENIG/ ENEPIG)
Die Bonder / FlipChip Bonder
Electro Chemical Plating / SFP(Stress Free Polish)/Coater
Electroless Plating(ENIG/ENEPIG) service
Filters and contamination control components
Fingerprint sensor coating
Flux Cleaner / Dry film PR stripper
Flux-Free Vacuum Reflow System, IGBT Module Vacuum Reflow System
MEMS Probe Pin Wafer Test Solution, Test Rubber Socket for Final Test
MFC 气体流量计 Mass Flow Controller
Non-vacuum & Vacuum wafer Reflow Oven System
Overlay measurement tool for packaging,TSV back-end process overlay
Plasma clean / plasma treatment
Positive/Negative Photoresist/ PSPI Developer
Precursor chemical in Thin film process
Pressure Oven/Vacuum Laminator
Rapid Probe Microscope (AFM)
Sintering Ag paste/Heat Dissipation Sheet
Thermal Release Tape for temporary bonding
Underfill material, wafer Level CSP material, Die Attach Adhesive
本网站使用cookies以提升您的使用体验及统计网站流量相关数据。继续使用本网站表示您同意我们使用cookies。我们的
隐私及Cookie政策提供更多关于
cookies使用及停用的相关信息。
我同意