Products & Service
制品サービス
2.5D / TSV bonder / De-Bonder Release Layer coating service
2D / 3D X-Ray CT Inspection Machine
2D/3D in-tray AOI Machine
2D&3D Wafer AOI Inspection System
Cu & Ti seed layer etchant /Electroless Plating (ENIG/ ENEPIG)
Die Bonder / FlipChip Bonder
Electro Chemical Plating / SFP(Stress Free Polish)/Coater
Electroless Plating(ENIG/ENEPIG) service
Filters and contamination control components
Fingerprint sensor coating
Flux Cleaner / Dry film PR stripper
Flux-Free Vacuum Reflow System, IGBT Module Vacuum Reflow System
MEMS Probe Pin Wafer Test Solution, Test Rubber Socket for Final Test
MFC 氣體流量計 Mass Flow Controller
Non-vacuum & Vacuum wafer Reflow Oven System
Overlay measurement tool for packaging,TSV back-end process overlay
Plasma clean / plasma treatment
Positive/Negative Photoresist/ PSPI Developer
Precursor chemical in Thin film process
Pressure Oven/Vacuum Laminator
Rapid Probe Microscope (AFM)
Sintering Ag paste/Heat Dissipation Sheet
Thermal Release Tape for temporary bonding
Underfill material, wafer Level CSP material, Die Attach Adhesive
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