半導體後段

台灣 中國

2.5D / TSV bonder / De-Bonder Release Layer coating service

2D / 3D X-Ray CT Inspection Machine

2D/3D in-tray AOI Machine

2D&3D Wafer AOI Inspection System

AMC Filter / Hepa Filter

Cleaning Chemical

Confocal Microscope

Cu & Ti seed layer etchant /Electroless Plating (ENIG/ ENEPIG)

Die Bonder / FlipChip Bonder

EBR & Stripper

Electro Chemical Plating / SFP(Stress Free Polish)/Coater

Electroless Plating(ENIG/ENEPIG) service

Filters and contamination control components

Fingerprint sensor coating

Flux Cleaner / Dry film PR stripper

Flux-Free Vacuum Reflow System, IGBT Module Vacuum Reflow System

Intelimer Adhesive

MEMS Probe Pin Wafer Test Solution, Test Rubber Socket for Final Test

MFC 氣體流量計 Mass Flow Controller

Non-vacuum & Vacuum wafer Reflow Oven System

Overlay measurement tool for packaging，TSV back-end process overlay

Plasma clean / plasma treatment

Plasma Clean Solution

Positive/Negative Photoresist/ PSPI Developer

Precursor chemical in Thin film process

Pressure Oven/Vacuum Laminator

Rapid Probe Microscope (AFM)

Sintering Ag paste/Heat Dissipation Sheet

Sintering Cu paste

Stripper

Thermal Release Tape for temporary bonding

Underfill material, wafer Level CSP material, Die Attach Adhesive